Hard Disk, MEMS & Semiconductor Applications

Hard Disk, MEMS & Semiconductor Applications
Hard Disc Media (disks)	Laser Etch Measurement
Hard Disk Heads (sliders)	Epitaxial Wafers
Step Height	IC Package Measurement
MEMS & Nanotechnology

IC Package Measurement

Overview
Backend process measurement is important for controlling the final quality of the IC package. Problems in IC packaging can cause connection issues when the device is soldered, detaching of wire bonds or bump on chip contacts and increased stress to be placed on the circuits of the IC. For these reasons it is important to control not just the geometry of the die, but also the flatness of the die seating area, the step height between the attachment points on the die and the package and the roughness of the wire bond attachment areas.

The products include:

Talysurf CCI 3000A
High speed non-contact 3D metrology system delivering 1 million measurement points over an area up to 7mm x 7mm. For the measurement of contact flatness, roughness, micro dimensions and step height with repeatability up to 0.1nm.

Talysurf CLI 2000
Scanning 3D profiler combining contact stylus, laser triangulation and chromatic confocal measurement sensors. Offering 200mm x 200mm maximum scanning area, up to 3mm vertical range and down to 0.01µm vertical resolution.

Metrology

Flatness
Matching the flatness of the die with that of the die seating area is important to reduce stress placed on the IC during the packaging process and throughout the operation of the device. Controlling the flatness of the overall package is also necessary to ensure correct placement of the IC and good electrical contact being made when soldered.

Roughness
The surface finish of the die seating area needs to be controlled to ensure good adhesion when the die is attached. Also the roughness of the wire bond attachment areas is important for good electrical conductivity and wire attachment security.

Step Height
There are many application for step height on the IC package. From the measurement of balls, bumps and leads to the package geometry itself including depth of the die seating area.

For further details contact your local sales representative