Hard Disk, MEMS & Semiconductor Applications

Hard Disk, MEMS & Semiconductor Applications
Hard Disc Media (disks)	Laser Etch Measurement
Hard Disk Heads (sliders)	Epitaxial Wafers
Step Height	IC Package Measurement
MEMS & Nanotechnology

Laser Etch Measurement

Overview
Laser etching is one of the predominant methods used for the identification marking of integrated circuits. This is partly due to the fact that laser marking is a tamper proof method of identification. Tamper proof marking has helped greatly reduce IC fraud, the selling of IC’s for higher speeds and specifications than they were produced for.

The products include:

Talysurf CLI 2000
Scanning 3D profiler combining contact stylus, laser triangulation and chromatic confocal measurement sensors. Offering 200mm x 200mm maximum scanning area and up to 3mm vertical range. For the measurement of laser etch depth and roughness.

Metrology

Step Height
As IC packages have become smaller and thinner the requirement for measuring step height of laser etching has become more important. The target depth of the laser etch is defined by two requirements. Firstly, it must be deep enough to provide tamper proof marking that can be read by IC identification systems and secondly, it must be shallow enough not to damage the circuits on the chip.

Roughness
The surface finish of the etched mark is an important factor in the easy reading of the final identification, whether by machine or human eye. The rougher the surface, the more light that is scattered and this increases the contrast of the mark to its surrounding surfaces.

For further details contact your local sales representative